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... > Physical system > Processing and Treatment (for both Material and Sample) > Treatment > Surface treatment > Mechanical and surface treatment > Mechanical and surface treatment method > Etching > Reactive ion etching
... > Physical system > Processing and Treatment (for both Material and Sample) > Treatment > Surface treatment > Surface structuring > Surface structuring method > Etching > Reactive ion etching

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Reactive ion etching  

定义

  • 1. RIE is like sputtering in the argon chamber, but the polarity is reversed and different gas mixtures are used. The atoms on the surface of the wafer fly away, leaving it bare. (Britannica). 2. Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.(Wikipedia)

上位概念

其它语言

  • Reactive ion etching

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https://purls.helmholtz-metadaten.de/skosmos/sdv/ReactiveIonEtching

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