Informationen zum Vokabular
URI
https://purls.helmholtz-metadaten.de/evoks/sdv/
Anzahl Ressourcen nach Typ
| Typ | Anzahl |
|---|
Anzahl Begriffe nach Sprache
| Sprache | Bevorzugte Begriffe | Synonyme | Versteckte Begriffe |
|---|
Seitenleisten-Liste: Vokabular-Inhalt nach Kriterien auflisten und durchlaufen
- Alphabetisch
- Hierarchie
Begriffe des Vokabulars alphabetisch auflisten
Vokabular-Konzepte hierarchisch auflisten
Auflistung der Vokabular-Begriffe nach Alphabet
-
- Carcinogenic
-
a
A
- Addition polymerization
- Adhesive bonding
- Administrative
- Aging
- Air
- Aligned elements
- Aligned structures
- Alloy
- Aluminium tape
- Amplitude parameter
- Annealing homogenization
- Annealing homogenization method
- Antiferromagnetic
- Antiphase boundaries
- Antisite defects
- Argon
- Aspect ratio
- Assessment
- Atomic layer deposition
- Atomic/molecular
- Axis orientation
-
b
B
- Back side
- Beam epitaxy
- Biohazard
- Biological
- Biomaterial
- Bottom
- Bulk material
-
c
C
- Carbon evaporation coating
- Carbon paint
- Carrier reference
- Carrier referencing
- Cartesian
- CAS number
- Ceramic
- Chemical formula
- Chemical vapour deposition
- Clamping
- Clean room conditions
- Cluster components
- Cluster size
- Clusters
- Code
- Combustive
- Completeness check
- Composite
- Composition
- Condensation polymerization
- Conductor
- Contaminant
- Cooling
- Cooling method
- Correlative characterization
- Corrosive
- Cracks
- Crazes
- Cryostat
- Crystal structures
- Crystalline/single crystal
- Crystallinity
- Curing
- Curing/hardening
- Custom holder
- Cylinder
-
d
D
- Data Curator
- Data repository
- Defects
- Deposition coating
- Deposition coating method
- Dessicator
- Diamagnetic
- Diameter
- Dielectric
- Dimpling
- Dish
- Dislocations
- Dissolution
- Dominant structures
- Dry air
- Dry blending
- Drying
- Drying oven
-
e
E
- eBeam
- Electrodeposition
- Electron beam deposition
- ELN
- Estimate
- Etching
- Evaporation/physical vapor deposition
- Exfoliation/cleavage/decapping
- Expiration date
- Exploratory
- Explosive
- External URL
-
f
F
- Feasibility
- Features of interest
- Ferrimagnetic
- Ferromagnetic
- Fiducials
- Filament
- Fixing method
- Focused ion beam
- Foil
- Freezer
- Front side
- Fume hood
- Functional test
-
g
G
- Gas
- Gas atmosphere
- Gas cooling
- Gas dosing/gas exposure
- Gas pressure
- Glass
- Glass slide
- Glove box
- Gloves
- Glue
- Grain boundaries
- Grains
- Grinding
- Grit blasting
-
h
H
- H2O/moisture
- Hazard
- High quality measurement
- High vacuum
- Holder on carrier
- Holder position on carrier
- Holder reference
- Holder referencing
- Homogenization
-
i
I
- iBeam
- In-situ polymerization
- Included in the Raw Data file
- Inclusions
- Inflammable
- Ink-jet deposition
- Instrument Scientist
- Insulator
- Interfaces
- Interlayer spacing
- Interstitial defects
- Ion beam deposition
- Ion implantation
- Irritant
-
j
J
- Joining
- Joining method
-
l
L
- Lamellar structures
- Langmuir-Blodgett film deposition
- Laser Surface Texturing (LST)
- Layer
- Layer thickness
- Layer type
- Leaf
- Left
- Liquid
- Liquid N dewar
- Lithography
-
m
M
- Macroscopic
- Magnetic domain walls
- Marker on carrier
- Marker on holder
- Material data sheet
- Material description
- Material form
- Material processing
- Material property
- Material treatment
- Material type
- Matrix-fiber interfaces
- Matrix-particle interfaces
- Max grain size
- Max humidity
- Max particle size
- Max pore size
- Max storage humidity
- Max storage temperature
- Mechanical and surface
- Mechanical and surface method
- Mechanical mixing
- Melt mixing
- Mesoscopic
- Metal
- Metamaterial
- MetaStore URI
- Microscopic
- Min grain size
- Min humidity
- Min particle size
- Min pore size
- Min storage humidity
- Min storage temperature
- Mixture
- Moisture
- Molecular fluid
- Monolayer
- Multilayer
- Mutagenic
-
n
N
- N2
- Nanoparticles
- Nanoscopic
- Nanosheets
- Nanostructured/nanoparticles
- Nanostructures
- Nanowires
- Nitrogen
- Nitrogen
- No tweezers regions
- Non-crystalline/amorphous
- Nonmagnetic
- Normalizing
- Number of layers
-
o
O
- O2
- Open bench
- Organic compound
- Organic solvents
- Organometallic
- Orientation
- Oxidising
- Oxygen
-
p
P
- Paper log book
- Paramagnetic
- Parent
- Parent reference
- Parent reference type
- Parent type
- Particle shape
- Particle type
- Particles
- Pattern
- Pellet
- Percolated
- Phase boundaries
- Phase of Matter
- Plain text
- Plasma
- Plasma spraying
- Plate
- Polar
- Polished
- Polishing
- Polycrystalline
- Polymer
- Pores
- Porosity
- Porous structures
- Post-polymerization modification
- Powder
- Powder processing
- Powder processing method
- Precursor
- Preparation action
- Preparation date
- Preparation description
- Preparation history file
- Preparation history file reference
- Preparation method
- Pressing
- Pulsed laser deposition
-
q
Q
- Qualitative
- Qualitative - gas pressure
- Qualitative - sample surface roughness
- Qualitative - storage pressure
- Quantitative
- Quantitative - gas pressure
- Quantitative - sample surface roughness
- Quantitative - storage pressure
-
r
R
- Ra
- Radiation
- Radioactive
- Reactive ion etching (RIE/IBE)
- Reactivity
- Recrystallization
- Reductive roasting
- Reinforcement structures
- Reinforcing material
- Research user
- Resistance welding
- Right
- Rod/bar
- ROI
- ROI reference
- Rough
- Rq
- Rz
-
s
S
- Safety information
- Sample
- Sample carrier
- Sample carrier description
- Sample carrier size
- Sample carrier type
- Sample component
- Sample description
- Sample handling
- Sample handling precaution
- Sample holder
- Sample holder description
- Sample holder size
- Sample holder type
- Sample ID
- Sample ID position
- Sample ID type
- Sample identification
- Sample mass
- Sample name
- Sample on holder
- Sample position on holder
- Sample preparation
- Sample producer
- Sample purpose
- Sample reference
- Sample referencing
- Sample shape
- Sample size
- Sample surface roughness
- Sample visible elements
- Sample volume
- Scale
- Sectioning
- Semiconductor
- Semicrystalline
- Sensitivity against
- Sensitivity list
- Shape options
- Sheet
- Sheet type
- Shock protection
- Shocks
- Sieve fraction preparation
- Silver paint
- Silver tape
- Size X - sample carrier
- Size Y - sample carrier
- Size Z - sample carrier
- Smart material
- Smooth
- Soldering/brazing/wire bonding
- Solid
- Solution processing
- Spin coating
- Sputter coating
- Sputtering
- Stacking faults
- Sterilization
- Storage conditions
- Storage equipment
- Storage gas atmosphere
- Storage pressure
- Stress relieving
- Stub
- Superconductor
- Surfaces
-
t
T
- Team Leader
- Team Member
- TEM grid
- Tempering
- Teratogenic
- Test specific hypothesis
- TestInfo
- Text
- Thermal plasma processing
- Thickness
- Thin film
- Tilting support
- Top
- Topological defects
- Toxic
- Twin boundaries
- Twin screw excrusion
- Twinned
-
u
U
- UHV chamber
- Ultra high vacuum
- Ultrasonication
- Unspecified annealing and homogenization
- Unspecified cooling
- Unspecified deposition and coating
- Unspecified joining
- Unspecified mechanical and surface
- Unspecified powder processing
- Unspecified reactive
- User name
- User role
-
v
V
- Vacancies
- Vacuum
- Vacuum annealing/heating
- Vacuum cooling
- Variations of air pressure
- Variations of gas concentration
- Variations of humidity
- Variations of temperature
- Visible elements options
- Voids
-
w
W
- Water
- Wire
-
x
X
- X
-
y
Y
- Y
-
z
Z
- Z