MatWerk: SampleDescriptionVocabulary-1: Wet etching

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Wet etching

1. Wet etching refers to the use of liquid chemicals. During the early days of Integrated Circuits (IC) development, this was the only kind of etchant in use. For many films in use, chemical etchants are available that provide acceptably controlled etch rates and high etch-rate selectivity to other layers. (Science direct, Coatings for Biomedical Applications Woodhead Publishing Series in Biomaterials 2012, Pages 143-175). 2. Wet etching utilizing liquid chemicals is generally isotropic and less precise, and is often used for wafer cleaning and substrate preparation. (https://resources.pcb.cadence.com/blog/2024-wet-etching-vs-dry-etching) 3. Wet etching is the process of removing a material chemically with a liquid reactant. It may involve a chemical which dissolves the material to be etched, or may utilize a chemical mixture which first oxidizes the material and then dissolves the oxide. (https://lnf-wiki.eecs.umich.edu/wiki/Wet_etching). 4. The process of using strong acids/alkalis to cut into the unprotected parts of a surface (e.g. metal or silicon) to create a pattern. (Chemical Methods Ontology). 5. Wet Etching is the process of removing material-etching, through the use of chemical activity. (Digital Reference)

https://purls.helmholtz-metadaten.de/evoks/sdv/WetEtching

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