Concept information
Preferred term
Reactive ion etching
Definition
- 1. RIE is like sputtering in the argon chamber, but the polarity is reversed and different gas mixtures are used. The atoms on the surface of the wafer fly away, leaving it bare. (Britannica). 2. Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.(Wikipedia)
URI
https://purls.helmholtz-metadaten.de/evoks/sdv/ReactiveIonEtching
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